Norcomp

Beckwith Electronics

Hamburg, Illinois 62045
(618) 232-1139
(618) 232-1172 fax

NorComp

180 SERIES
FEATURES: Available in 5 industry sizes/positions (15, 26, 44, 62, 78) Approximately 65% higher density than standard D-SUB connectors. Low cost/ high proformance stamped contacts. Interfaces with IBM PS/2. Metal shell provides EMI/RFI shielding. Plug shells have indents to provide grounding and additional retention Connectors will fit in standard D-Sub backshells. MATERIALS: Shell: Steel with bright tin plating. Insulator: Glass-filled thermoplastic. U.L. rated 94V-0. Contacts: Male Pins - Brass Female Pins - Phosphor bronze. Plating: Gold flash on entire contact. (Contact Beckwith Electronics for other plating options.)	Solder Cup High Density Connectors

180 SERIES

FEATURES:

Available in 5 industry sizes/positions (15, 26, 44, 62, 78)

Approximately 65% higher density than standard D-SUB connectors.

Low cost/ high proformance stamped contacts.

Interfaces with IBM PS/2.

Metal shell provides EMI/RFI shielding.

Plug shells have indents to provide grounding and additional retention

Connectors will fit in standard D-Sub backshells.

MATERIALS:
Shell: Steel with bright tin plating.
Insulator: Glass-filled thermoplastic. U.L. rated 94V-0.
Contacts:
Male Pins - Brass
Female Pins - Phosphor bronze.
Plating: Gold flash on entire contact.
(Contact Beckwith Electronics for other plating options.)

Solder Cup
High Density Connectors

Ordering Information See hardware table for hardware options
Position		Part Numbers	Dimentions
Position		Solder Cup	A	B	C
15	Male	180-015-102-001	1.213	.984	.496
15	Female	180-015-202-001	30.81	24.99	12.60
26	Male	180-026-102-001	1.543	1.312	.496
26	Female	180-026-202-001	39.19	33.32	12.60
44	Male	180-044-102-001	2.087	1.852	.496
44	Female	180-044-202-001	53.00	47.04	12.60
62	Male	180-062-102-001	2.732	2.500	.496
62	Female	180-062-202-001	69.39	63.50	12.60
78	Male	180-078-102-001	2.638	2.406	.606
78	Female	180-078-202-001	67.00	61.11	15.39