Beckwith Electronics


Hamburg, Illinois 62045
(618) 232-1139

(618) 232-1172 fax

Contact Us

NorComp



180 SERIES
FEATURES:
Avaiable in 5 industry sizes/positions (15, 26, 44, 62, 78).
Approximately 65% higher density than standard D-Sub connectors.
Low cost/high performance stamped contacts.
Interface with IBM PS/2.
Tin plated shell provides EMI/RFI shielding.
Plug shells have indents to provide grounding and additional retention.
Connectors will fit standard D-Sub backshells.

MATERIALS:
Slell: Steel with bright tin plating.
Insulator: Glass-filled thermoplastic. U.L. rated 94V-0.
Crimp and Poke
High Density Connectors



Ordering Information
(Note: Contacts must be ordered separately)
See hardware table for hardware options
Positions Part Numbers Dimensions
Crimp & Poke A B C
15 Male 180-015-172-000 1.213 .984 .496
Female 180-015-272-000 30.81 24.99 12.60
26 Male 180-026-172-000 1.543 1.312 .496
Female 180-026-272-000 39.19 33.32 12.60
44 Male 180-044-172-000 2.087 1.852 .496
Female 180-044-272-000 53.00 47.04 12.60
62 Male 180-062-172-000 2.732 2.500 4.96
Female 180-062-272-000 69.39 63.50 12.60
78 Male 180-078-172-000 2.638 2.406 .606
Female 180-078-272-000 67.00 61.11 15.39
(NOTE: Contacts must be ordered seperately)
Contact Beckwith Electronics for hardware options