NorComp

180 SERIES

FEATURES: Avaiable in 5 industry sizes/positions (15, 26, 44, 62, 78). Approximately 65% higher density than standard D-Sub connectors. Low cost/high performance stamped contacts. Interface with IBM PS/2. Tin plated shell provides EMI/RFI shielding. Plug shells have indents to provide grounding and additional retention. Connectors will fit standard D-Sub backshells. MATERIALS: Slell: Steel with bright tin plating. Insulator: Glass-filled thermoplastic. U.L. rated 94V-0.

Crimp and Poke High Density Connectors

Ordering Information (Note: Contacts must be ordered separately) See hardware table for hardware options
Positions		Part Numbers	Dimensions
		Crimp & Poke	A	B	C
15	Male	180-015-172-000	1.213	.984	.496
	Female	180-015-272-000	30.81	24.99	12.60
26	Male	180-026-172-000	1.543	1.312	.496
	Female	180-026-272-000	39.19	33.32	12.60
44	Male	180-044-172-000	2.087	1.852	.496
	Female	180-044-272-000	53.00	47.04	12.60
62	Male	180-062-172-000	2.732	2.500	4.96
	Female	180-062-272-000	69.39	63.50	12.60
78	Male	180-078-172-000	2.638	2.406	.606
	Female	180-078-272-000	67.00	61.11	15.39

(NOTE: Contacts must be ordered seperately)
Contact Beckwith Electronics for hardware options