Beckwith Electronics


Hamburg, Illinois 62045
(618) 232-1139
(618) 232-1172 fax

Contact Us

NorComp



115 SERIES
FEATURES:
Available in 2 industry sizes/positions (50, 68).
Excellent I/O connector.
Highly reliable for high density packaging.
Pin and socket design.

MATERIALS:
Shell: Steel with Nickel plating.
Insulator: High temperature thermoplastic, U.L. rated 94V-O.
Contacts: Copper Alloy.
(Contact Beckwith Electronics for plating options).

 Half Pitch Pin Connector
SCSI 2 & 3 DIP Solder




Ordering Information
Position Part Numbers Dimensions
A B C D
50 Female

115-050-213-001 2.055 1.830 1.200 1.364 52.20 46.48 30.48 34.65 68 Female 115-068-213-001 2.505 2.280 1.650 1.816 63.63 57.91 41.91 46.13