Hamburg, Illinois 62045
(618) 232-1172 fax
Uses same surface mount soldering technology as BGA devices.
LGA device is accurately aligned and seated in socket base prior to mounting of top.
Controlled contact deflection.
Simple mounting hardware requiring standard tools.
Intergral threaded mounting inserts in the base solder to top side of PCB and provide ample mounting pressure on device to eliminate need for backing plate on bottom side of PCB. Also reduces strain on solder ball terminations.
Tooling/alignment holes in base provided as an added alignment feature to locate the socket base to the PCO pattern.
Open window or metal top for heat sink application available as a special feature.
Land Grid Array
Socket, 16x16 Grid,
256 Pin, .050 [1.27] Pitch