Beckwith Electronics

Hamburg, Illinois 62045
(618) 232-1139

(618) 232-1172 fax

Contact Us

Aries Electronics

Makes BGA devices socketable when used in lieu of soft solder balls.
Adds only .100 [2.54] height to profile when mated in BallLockTM socket.
Pin configuration eases insertion into BallLockTM socket and provides positive "snap" feature.

Pin is Brass Alloy 360, 1/2 hard per UNS C36000 ASTM-B-85.
Pin plating is 10 u [.25 um] min. Gold per MIL-G-45204 over 100 u [2.54 um] min. Nickel per QQ-N -290. Other plating options available. Consult Beckwith Electronics for details.
Contact current rating = 1 Amp.

See Aries BGA BallLockTM Data Sheet 23002.

Surface Mount
BGA Adapter Pin