FEATURES:
 Converts BGA packages into socketable "hard-ball" terminations.
Adds only .150 [3.81] height to profile when mated in BallLockTM socket.
Pin configuration eases insertion into BallLockTM socket and provides positive "snap" feature.
SPECIFICATIONS:
Adapter body is UL 94V-0 FR-4, .062 [1.58) thick.
Pin is Brass Alloy 360, 1/2 hard per UNS C36000 ASTM-B-85.
Pin plating is 10 u [.25 um] min. Gold per MIL-G-45204 over 100 u [2.54 um] min. Nickel per QQ-N-290.
Contact current rating =1 Amp.
Operating temperature=257°F [125°C].
MOUNTING CONSIDERATIONS:
See Aries BGA BallLockTM data sheet 23002.
"A"=(No. of Pins per Column -1) x "C" +.100 [2.54]
"B"=(No. of Pins per Row -1) x "C" +.100 [2.54]
"C"=Pitch
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