|
FEATURES:
 Any grid size available on either 1.27mm [.050"] or 1.50mm [.059"] pitch.
Lidless design - ball locks into two-fingered contact.
Ultra-low profile socket adds only .050 [1.27] to overall package height (.100 [2.54] with SnapAdaptTM pins).
Corner guides aid in package insertion (not used with SnapAdaptTM pins).
Consult Data Sheet Nos. 23003 and 23004 for Aries BallNestTM Socket.
SPECIFICATIONS:
Socket body is UL 94V-0 FR-4.
Optional lead-in guides are black UL 94V-0 Glass-filled Thermoplastic (PPS).
Contacts are Beryllium Copper Alloy per QQ-C-533.
Contact plating is either 100 u [2.54 um] min. 90/10 Tin/Lead per MIL-T-10727 or 10 u [.25 um] min. Gold per MIL-G-45204 over 30 u [.76 um] Nickel per QQ-N-290.
Solder ball terminations are 90/10 Lead/Tin.
Solder paste is 63/37 eutectic.
Solder mask is "dryfilm."
Inductance<1nH/cont. @ 100 MHz approx. (under testing).
Capacitance<1 pf/contact @ 100 MHz approx. (under testing).
Contact resistance = 10m Ohms initial, 20m Ohms @10 cycles (under testing).
Durability = 10 cycles max.; up to 50 cycles with SnapAdaptTM pin.
Insertion Force = 50 grams/contact avg. (approximate); 40 grams/contact initial when used with SnapAdaptTM pin.
Withdrawal Force=20 grams/contact max. (approximate).
Socket accepts BGA devices with .030 [.76] dia. balls.
MOUNTING CONSIDERATIONS:
Suggested PCB pad size = .025+.003 [.64+.08] dia.
"A"=BGA Package Size +.085 [2.29]
"B"=(No. of Positions per Row -1) x BGA Pitch
"C"=BGA Package Size +.010 [.25]
"D"=BGA Package Size +.060 [1.52]
|
