Aries Electronics

FEATURES:

Convert surface mount QFP packages to a 13 x 13 PGA footprint.

Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

Pins are mechanically fastened and soldered to board using Aries' patented process, creating a reliable electrical connection and rugged contact.

Consult Beckwith Electronics for panelized form or for mounting of consigned chips.

SPECIFICATIONS:
Adapter body is black FR-4 with 1 oz. min. Copper traces.
Pads are bare Copper protected with Entek^® by Enthone to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min. Nickel per QQ-N-290.
Operating temperature=221°F [125°C].

MOUNTING CONSIDERATIONS:
Suggested PCB hole size .028 + .003 [.71 + .08] dia.
Will plug into standard PGA sockets.

Part No. 96-080M80
QFP to PGA Adapter
for EIAJ 80 Position,
.0315 [.80] Pitch
Correct-A-Chip^tm Technology

Tolerances:
Row-to-row:	+ .003 [+ .08]
Pin-to-pin:	+ .003 [+ .08]	non-cumulative
All others:	+ .005 [+ .13]	unless otherwise specified