Beckwith Electronics

Hamburg, Illinois 62045
(618) 232-1139

(618) 232-1172 fax

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Aries Electronics

Convert surface mount QFP packages to a 13 x 13 PGA footprint.
Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
Pins are mechanically fastened and soldered to board using Aries' patented process, creating a reliable electrical connection and rugged contact.
Consult Beckwith Electronics for panelized form or for mounting of consigned chips.

Adapter body is black FR-4 with 1 oz. min. Copper traces.
Pads are bare Copper protected with Entek® by Enthone to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min. Nickel per QQ-N-290.
Operating temperature=221°F [125°C].

Suggested PCB hole size .028 + .003 [.71 + .08] dia.
Will plug into standard PGA sockets.

Part No. 95-100I25
QFP to PGA Adapter
for JEDEC 100 Position,
.025 [.64] Pitch
Correct-A-Chiptm Technology

Row-to-row: + .003 [+ .08]
Pin-to-pin: + .003 [+ .08] non-cumulative
All others: + .005 [+ .13] unless otherwise specified