Designed to allow user to cut 32 position adapter down to any size desired.
Pins are mechanically fastened and soldered to board using Aries' patented process, creating a reliable electrical connection and rugged contact.
Adapter body is black FR-4 with 1 oz. min. Copper traces.
Pads are bare Copper protected with Entek® by Enthone to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min. Nickel per QQ-N-290.
Operating temperature=221°F [105°C].
Suggested PCB hole size=.028 + .003 [.71 + .08] dia.
Will plug into standard IC sockets.
TSOP to DIP
.600 [15.24] DIP Adapter