FEATURES:
Converts PLCC packaged ICs to DIP footprints.
Ideal for prototyping and testing/evaluation.
Available with PLCC sockets or PLCC pads on top side.
Consult Beckwith Electronics for panelized form or for mounting of consigned ICs.
SPECIFICATIONS:
Adapter body is black FR-4, .062 [1.58] thick, with
1 oz. min. Copper traces.
Solder tail pins are Brass Alloy 360 1/2 hard per UNS
C36000 ASTM-B16-85.
Solder tail pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead
per MIL-P-81728 over 100 u [2.54 um] min. Nickel per
QQ-N-290.
Optional PLCC sockets are white UL 94V-0 Liquid Crystal
Polymer (LCP).
Socket contacts are Copper Alloy.
Socket contact plating is 150 u [3.81 um] min. Tin over 40 u [1.02 um] min. Nickel.
Consult Data Sheet Nos. 14001 and 14002 for further PLCC socket information.
Current rating=1 Amp.
Operating temperature=221°F [125°C].
MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.028 + .003 [.71 + .08] dia.
Will plug into standard IC sockets.
See table for pad layout when mounting PLCC socket.
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