Aries Electronics

FEATURES:

Accommodates shrink-pack ICs with pin-to-pin spacing of .070 [1.77] produced by Hitachi, Mitsubishi, T.I., and others for microprocessors and microcomputers.

Single-beam contact pins with low insertion force.

Guide rails for easy lead insertion.

SPECIFICATIONS:
Socket body is blue UL 94V-0 Glass-filled Polyester Thermoplastic (PBT).
Single-beam contacts are Beryllium Copper Alloy 174.
Contact plating is 100 u [2.54 um] Tin Alloy over 50 u[1.27 um] Nickel.
Contact current rating=1 Amp.
Operating temperature=221°F [105°C].
Accepts leads up to .020 wide x .025 thick [.51 x .64], .100-.140 [2.54-3.56] long.

MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.033 + .002 [.84 + .05] dia.

Series 570
.070 [1.78] Pitch
Pin-to-Pin Sockets
for Shrink-DIP Packages

Part Number	No. of Pins	Dim. A	Dim.B	Dim. C	Dim. D	Dim. E	Dim. F
20-570-10	20	.705 [17.91]	.630 [16.00]	.600 [15.24]	.690 [17.53]	None	.455 [11.56]
40-570-10	40	1.405 [35.69]	1.330 [33.78]	.600 [15.24]	.690 [17.53]	.730 [18.54]	1.155 [29.34]
52-570-10	52	1.825 [46.36]	1.750 [44.45]	.600 [15.24]	.690 [17.53]	.940 [23.88]	1.575 [40.00]
64-570-10	64	2.245 [57.02]	2.170 [55.12]	.750 [19.05]	.840 [21.34]	1.150 [29.21]	1.995 [50.67]