Hamburg, Illinois 62045
(618) 232-1172 fax
Accommodates shrink-pack ICs with pin-to-pin spacing of .070 [1.77] produced by Hitachi, Mitsubishi, T.I., and others for microprocessors and microcomputers.
Single-beam contact pins with low insertion force.
Guide rails for easy lead insertion.
.070 [1.78] Pitch
for Shrink-DIP Packages