JEDEC Type A PC board patterns for surface mount pins on .050 [1.27] centers.
Low profile, open plastic for easy surface mount solder joint inspection.
Center pad provided for pick and place or adhesive bonding.
Reflow solderable by all conventional processes.
Optional polarization pins are available.
Body material is black UL 94V-0 PPS.
Contacts are Phosphor Bronze.
Contact plating is 120 u [3.05 um] min. Tin over 35 u [.89 um] min. Nickel.
Contact current rating=1 Amp.
Contact resistance=30m Ohms max. @ DC 100m Amps.
Withstanding voltage=500 VAC for 1 minute.
Operating temperature= -67°F to 221°F [-55°C to 105°C].
Insulation resistance=1000M Ohms min. @ DC 100V.
See PCB pad detail below and Data Sheet No. 14002.