Aries Electronics

FEATURES:
Designed specifically to fit Mitsubishi, Fujitsu, etc. Dynamic RAMs, these sockets have collet pins staggered in a zig-zag configuration.
Side-to-side and end-to-end stackable.

SPECIFICATIONS:
Body material is blue Glass-filled Polyester Thermoplastic.
Pin body is Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin body plating is either 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 or 10 u [.25 um] min. Gold per MIL-G-45204 over 100 u [2.54 um] min. Nickel per QQ-N-290.
6-fingered (midget pin is 4-fingered) collet contact is Beryllium Copper Alloy per UNS C17200 ASTM-B194-92.
Contact plating is either 150 u [3.81 um] min. 93/7 Tin/Lead per MIL-P-81728 or 10 u [.25 um] min. Gold per MIL-G-45204 over 50 u [1.27 um] min. Nickel per QQ-N-290. Wire wrap pin available only with 30 u [.76 um] min. Gold on contact.
Contact current rating=3 Amps.
Operating temperature:
    221°F [105°C] Tin plating,
    257°F [125°C] Gold plating.
Insertion Force=67 grams/pin; Withdrawal Force=30 grams/pin; Normal Force=45 grams/pin; based on a .018 [.46] diameter test lead.
For midget pin: Insertion Force=370 grams/pin; Withdrawal Force=150 grams/pin; Normal Force=240 grams/pin; based on a .018 [.46] diameter test lead.

MOUNTING CONSIDERATIONS:
See table below.

"A"= (No. of Pins +1) X .050 [1.27]
"B"= (No. of Pins -1) X .050 [1.27]