Convert surface mount PLCC packages to a PGA footprint.
Optional open frame allows for more efficient Utilization of board space and better cooling.
Pin polarization option also available.
Consult Beckwith Electronics for panelized form or for mounting of consigned chips.
Adapter body is black FR-4, .062 [1.58] thick, with 1 oz. min. Copper traces.
Pads are hot-air solder leveled.
Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B 16-85.
Pin plating is 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 over 100 u [2.54 um] min. Nickel per QQ-N-290. Optional 10 u [.25 um] Gold plating also available.
Operating temperature=221°F [125°C].
Suggested PCB hole size=.028 + .003 [.71 + .08] dia.
Will plug into standard PGA sockets.
Series 505 PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices Correct-A-Chiptm Technology