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Aries Electronics

FEATURES:
Aries EJECT-A-DIP® is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance.
The latch locks in the connector or device, making it ideal for high vibration environments.
The latch, when used as an ejector, removes DIP packages without pin damage.

SPECIFICATIONS:
Latch and body are blue UL 94V-0 Glass-filled Polyester Thermoplastic (PBT).
Pin body is Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85.
Pin body plating is either 200 u [5.08 um] min. 93/7 Tin/Lead per MIL-P-81728 or 10 u [.25 um] min. Gold per MIL-G-45204 over 100 u [2.54 um] min. Nickel per QQ-N-290.
6-fingered collet contact is Beryllium Copper Alloy per UNS C17200 ASTM-B194-92.
Contact plating is either 150 u [3.81 um] min. 93/7 Tin/Lead per MIL-P-81728 or 10 u [.25 um] min. Gold per MIL-G-45204 over 50 u [1.27 um] min. Nickel per QQ-N-290. Heavy 30 u [.76 um] Gold plating on contact also available.
Contact current rating=3 Amps.
Insulation resistance=10,000M Ohms @ 500 VDC.
Withstanding voltage=1,000V RMS.
Operating temperature:
    -67°F to 221°F [-55°C to 105°C] Tin plating,
    -67°F to 257°F [-55°C to 125°C] Gold plating.
Insertion Force= 67grams/pin; Withdrawal Force=30 grams/pin; Normal Force=45 grams/pin; based on .018 [.46] dia. test lead.

MOUNTING CONSIDERATIONS:
Suggested PCB hole size=.030 + .002 [.76 + .05] dia.

Series EJECT-A-DIP®
Lock/Eject DIP
Collet Sockets
with Solder Tail Pins


Selection Table and Drawings

24-C182-10T

24 Pins
Solder Tail
Gold Collet, Tin Shell
Tin Collet